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owtemperaturecuring
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required. Huizhou City, Guangdong，China
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11-14-2022
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First Name
Low temperature curing
Last Name
epoxy adhesive
Date of Birth
09-27-1984
About Me
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required. Huizhou City, Guangdong，China Website: https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-sensitive-devices-and-circuit-protection.html
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